2016-2023 Microchip Technology Inc. DS50002489G-page 23
RN4870/71
FIGURE 4-13: RECOMMENDATIONS FOR PLACEMENT OF THE MODULE ON HOST PCB BOARD
4.5 Soldering Recommendations
The RN4870/71 Bluetooth module is assembled using
standard lead-free reflow profile, IPC/JEDEC J-STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following
recommendations are given:
• Microchip Technology Application Note, AN233
“Solder Reflow Recommendation” (DS00233)
provides solder reflow recommendations
•Do not exceed Peak Temperature (T
P
) of 250°C
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
•Do not wash as moisture can be trapped under
the shield
• Use only one flow; if the PCB requires multiple
flows, apply the module on the final flow
Acceptable
Best
Acceptable
Lowest
Performance
Downloaded from Arrow.com.
To Next Page
Loading...
