3.
GENERAL
smmmoNs
/MELSEC~A
3.
GENERAL
SPECIFCATKINS
Table
3.1
shows the
common
specifications
of
various
modules
used.
ttm
Operating ambient
temperature
Storage ambient
temperature
Operating ambient
humidity
Storage ambient
humidity
Vibration resistance
Shock resistance
Noise durability
Dielectric withstand
voltage
Insulation resistance
~ ~~~
Grounding
Operating ambience
Cooling method
~ ~~~~
0
to
65c
-20
to
75c
10
to
90%
RH,
noncondensing
10 to
90%
RH,
noncondensing
Conforms to
JIS
C
0911
10
to
55
Hz
-
0.075
mm
(0.003
in) 10 times
55
to 150
HZ
1G
-
*(l
octavdminute)
1
Conforms to
JIS
C
0912
(10
g
X
3
times in
3
directions)
1
By
noise simulator
of
1500
Vpp noise voltage,
1
p
s
noise width and
25
to
60
Hz
noise frequency
1500 VAC for
1
minute across AC external terminals and ground
500
VAC for 1 minute across
DC
external terminals and ground
5
MP
or larger by
500
VDC insulation resistance tester across
AC external terminals and ground
Class
3
grounding; grounding
is
not required when it
is
impossible.
Free of corrosive gases.
Dust
should
be
minimal.
Self-cooling
Tabb
3.1
0.n.t.l
Smom
One octave marked indicates
a
change from the initial frequency to double or
half frequency. For example, any of the changes from
10
Hz
to 20
Hz,
from
20
Hz
to
40
Hz,
from
40
Hz
to
20 Hz,
and 20
Hz
to 10
Hz
are referred to as one octave.
When checking the module with withstanding voltage, apply voltage after
disconnecting the
FG,
LG and ground terminals.
d
c
i
1
-1
c
I
1
1
I
Y
Note: JIS: Japanese Industrial Standard
-
/I
’P
n
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