Disassembly/Reassembly Procedures: Serviceable Components of the Main Sub-Assemblies 7-15
7.5.1.1 Servicing Coin Cell:
1. Complete steps from Section 7.4.5.1. through Section 7.4.5.3.
2. Remove the coin cell with the Black Stick.
NOTE: Make sure the positive side is facing upwards.
3. Press the new coin cell into the battery carrier until it is secured and fully snapped into place.
7.5.1.2 Servicing Thermal Pad:
1. Complete steps from Section 7.4.5.1. through Section 7.4.5.3.
2. Carefully peel off the pad.
3. Ensure there is no debris or residue left on the amplifier’s surface.
4. Replace with new Thermal Pad.
5. Peel the liner off the new pad and place in the respective location. Make sure the bottom
surface of the pad is mating with the top surface of the amplifier.
6. Apply slight pressure to activate the adhesive.
7.5.1.3 Servicing Absorber:
1. Complete steps from Section 7.4.5.1. through Section 7.4.5.3.
2. Carefully peel off the Absorber.
3. Ensure there is no debris or residue left on the board surface.
4. Replace with the new Absorber.
5. Peel the liner off the new absorber and place in the respective location. Make sure it is not
placed outside the legend printed on the board.
6. Apply slight pressure to activate the adhesive.
Thermal pad should always be replaced when the Main board
assembly is removed.
Absorber should always be placed within the white
rectangular legend printed on the board.
Absorber should always be replaced when the Main Board
assembly is removed.
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