Industrial Automation Wiring and Grounding Guidelines E115P
4
Mounting, Bonding, and Grounding
After establishing all layouts, you can begin mounting,
bonding, and grounding each chassis. Bonding is the
connecting together of metal parts of chassis, assemblies,
frames, shields, and enclosures to reduce the effects of
EMI and ground noise. Grounding is the connection to
the grounding-electrode system to place equipment at
earth ground potential.
Figure 1 – Mounting Assembly Details
Enclosure Wall
I/O Block
Transformer
Use greater
spacing
without conduit
Tighter spacing
allowed with conduit
Tighter spacing allowed
where forced by spacing
of connection points
Place modules to
comply with spacing
guidelines if possible
Category-1
Conductors
(AC Power Lines)
Category-2
Conductors
Category-2
Conductors
Conduit
1771 I/O Chassis
Conduit
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