Philips 241B4LPCS/00 - Page 81

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3. Lead-free product identification
You can identif lead-free product b Philips-lead-free loo on PCB.
4. Lead-free product repair instruction
4.1 Use onl lead-free Solder Allo 0622 149 00106(1.2mm SAC305) or 0622 14900108(1.0mm SAC305).
Remark For lead free solderin material please visit www.alphametals.com
website for details. This is recommended b Philips.
4.2 Use onl adeuate solder tools applicable for lead-free solderin-tin. The solder tool must be able to reach at least a solder-temperature of 400 to
stabilie the adusted temperature at the solder-tip and to echane solder-tips for different applications.
Small Passives/Actives to be removed with thermal tweeers
Automated sstem for IC and BGA repair (Microscope Camera Beam split optics Computer Prorammer Heat controllers Vacuum sstem Laser
pointer) Solder Hand-Tool (Adustable in temperature heiht Temperature shall be held constant Fleible tips)
4.3 Adust our solder tool so that a temperature around 360 -380 is reached and stabilied at the solder oint.
Heatin-time of the solder-oint should not eceed  4 sec. Avoid temperatures above 400 otherwise wear-out of tips will rise drasticall and flu-fluid will
be destroed. Corrosion of Tool-Spikes can be avoided when usin SAC305 and a temperature of less than 400.
4.4 Mi of lead-free solder-tin/parts with leaded solderin-tin/parts is possible but not recommended. If not to avoid clean carefull the solder-oint from old
tin and re-solder with new tin.
4.5 Use onl oriinal spare-parts listed in the Service-Manuals. Standard-material (consumables) can also be purchased at eternal companies.
4.6 Special information for lead-free BGA-ICs this ICs will be delivered in so-called dr-packain to protect the IC aainst moisture and with lead-free
loo on it. This packain ma onl be opened shortl before it is used (soldered). Otherwise the bod of the IC ets wet inside and durin the heatin
time the structure of the IC will be destroed due to hih (steam-) pressure. If the packain was opened before usae the IC has to be heated up for
some hours (around 90 ) for drin (Take attention for ESD-protection)
5. Rework on BGA (Ball Grid Arra) ICs
General
Althouh (LF)BGA assembl ields are ver hih there ma still be a reuirement for component rework. B rework we mean the process of removin
the component from the PWB and replacin it with a new component. If an (LF) BGA is removed from a P WB the solder balls of the component are
deformed drasticall so the removed (LF)BGA has to be discarded.
Device Removal
As is the case with an component that it is essential when removin an (LF) BGA the board tracks solder lands or surroundin components are not
damaed. To remove an (LF)BGA the board must be uniforml heated to a temperature close to the reflow solderin temperature. A uniform temperature
reduces the chance of warpin the PWB.
To do this we recommend that the board is heated until it is certain that all the oints are molten. Then carefull pull the c
omponent off the board with a
vacuum nole. For the appropriate temperature profiles see the IC data sheet.
Area Preparation
When the component has been removed the vacant IC area must be cleaned before replacin the (LF) BGA. Removin an IC often leaves varin
amounts of solder on the mountin lands. This ecessive solder can be removed with either a solder sucker or solder wick. The remainin flu can be
removed with a brush and cleanin aent. After the board is properl cleaned and inspected appl flu on the solder lands and on the connection balls of
the (LF)BGA
Note
Do not appl solder paste as this has shown to result in problems durin re-solderin.
Device Replacement
The last step in the repair process is to solder the new component on the board. Ideall the (LF) BGA should be alined under a microscope or
manifin lass. If this is not possible tr to alin the (LF)BGA with an board markers. To reflow the solder  appl a temperature profile accordin to
the IC data sheet. So as not to damae neihbourin components it ma be necessar to reduce some temperatures and times.
More Information
For more information on how to handle BGA devices visit this URL http//www.atourservice.ce.philips.com (needs subscription). After loin select
Maaine then o to Workshop Information. Here ou will find Information on how to deal with BGA-ICs.
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