OPERATING DETAILS
A. Gently put the item to be processed on the flat surface in the drawer, close the drawer,
then select the desired function and press OK/RETURN Button to execute. The LCD
shows as below:
B. The process will be done automatically under your supervision through the front window
& the LCD data. (If the actual measured temperature value differs greatly from the set
temperature value, the machine may alarm to prompt.)
C. Press OK/RETURN Button can force the machine to stop at any time, if necessary.
D. After the processing is completed, the fan will cool the machine automatically.
E. If the result is not as expected, it can be processed again.
SUGGESTIONS
A. To satisfy the soldering of small boards, please place a 10x10cm PCB board under it
when soldering small-sized PCB boards and BGA balls to ensure soldering quality.
B. Please preheat the machine when the environment is of low temperature or high
humidity. The method: run the heating curve without placing any items.
C. The chips with metal encapsulation of strong reflective material and the plastic inserts
that withstand temperatures below 250°C cannot be soldered using this machine.
D. The method to measure the temperature of the machine: use a standard thermometer
to tightly fix the external temperature probe directly above the PCB, then put the PCB in
the drawer, and push it into the machine for testing. The temperature measured in this way
is more in line with the actual situation during machine processing.
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