Quectel FGH100M - ESD Protection; Digital I;O Characteristics; Thermal Dissipation

Wi-Fi Module Series
FGH100M_Hardware_Design 27 / 41
5.3. ESD Protection
Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD
countermeasures and handling methods is imperative. For example, wear anti-static gloves during the
development, production, assembly and testing of the module; add ESD protection components to the
ESD sensitive interfaces and points in the product design.
Table 11: Electrostatics Discharge Characteristics (Unit: kV)
5.4. Digital I/O Characteristics
Table 12: VDDIO I/O Characteristics (Unit: V)
5.5. Thermal Dissipation
The module offers the best performance when all internal IC chips are working within their operating
temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may
still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a
certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips
always work within the recommended operating temperature range.
The following principles for thermal consideration are provided for reference:
Model
Test Result
Standard
Human Body Model (HBM)
±1.5
ESDA/JEDEC JS-001-2017
Charge Device Model (CDM)
±0.25
ESDA/JEDEC JS-002-2018
Parameter
Description
Min.
Max.
V
IH
High-level Input Voltage
0.7 × VDDIO
VDDIO + 0.2
V
IL
Low-level Input Voltage
-0.3
0.3 × VDDIO
V
OH
High-level Output Voltage
0.9 × VDDIO
-
V
OL
Low-level Output Voltage
-
0.1 × VDDIO