Quectel FGH100M - Table of Contents

Wi-Fi Module Series
FGH100M_Hardware_Design 5 / 41
Contents
Safety Information ...................................................................................................................................... 3
About the Document .................................................................................................................................. 4
Contents ...................................................................................................................................................... 5
Table Index .................................................................................................................................................. 7
Figure Index ................................................................................................................................................ 8
1 Introduction ......................................................................................................................................... 9
1.1. Special Mark .............................................................................................................................. 9
2 Product Overview ............................................................................................................................. 10
2.1. Key Features ............................................................................................................................ 11
2.2. Functional Diagram .................................................................................................................. 12
3 RF Performances .............................................................................................................................. 13
3.1. Wi-Fi Performances ................................................................................................................. 13
4 Application Interfaces ...................................................................................................................... 15
4.1. Pin Assignment ........................................................................................................................ 15
4.2. Pin Description ......................................................................................................................... 16
4.3. Power Supply ........................................................................................................................... 19
4.4. Wi-Fi Application Interface ....................................................................................................... 20
4.4.1. SDIO Interface .............................................................................................................. 20
4.5. JTAG Interface ......................................................................................................................... 21
4.6. RF Antenna Interface ............................................................................................................... 21
4.6.1. Reference Design ......................................................................................................... 22
4.6.2. RF Routing Guidelines .................................................................................................. 22
4.6.3. RF Connector Recommendation .................................................................................. 24
5 Electrical Characteristics & Reliability ........................................................................................... 26
5.1. Absolute Maximum Ratings ..................................................................................................... 26
5.2. Power Supply Ratings .............................................................................................................. 26
5.3. ESD Protection ......................................................................................................................... 27
5.4. Digital I/O Characteristics ........................................................................................................ 27
5.5. Thermal Dissipation ................................................................................................................. 27
6 Mechanical Information .................................................................................................................... 29
6.1. Mechanical Dimensions ........................................................................................................... 29
6.2. Recommended Footprint ......................................................................................................... 31
6.3. Top and Bottom Views ............................................................................................................. 32
7 Storage, Manufacturing & Packaging ............................................................................................. 33
7.1. Storage Conditions................................................................................................................... 33
7.2. Manufacturing and Soldering ................................................................................................... 34
7.3. Packaging Specifications ......................................................................................................... 36
7.3.1. Carrier Tape .................................................................................................................. 36