Wi-Fi Module Series
FGH100M_Hardware_Design 8 / 41
Figure Index
Figure 1: Functional Diagram ..................................................................................................................... 12
Figure 2: Pin Assignment (Top View) ........................................................................................................ 15
Figure 3: Reference Circuit of Power Supply ............................................................................................. 19
Figure 4: SDIO Interface Connection ......................................................................................................... 20
Figure 5: Reference Circuit for RF Antenna Interface ............................................................................... 22
Figure 6: Microstrip Design on a 2-layer PCB ........................................................................................... 22
Figure 7: Coplanar Waveguide Design on a 2-layer PCB ......................................................................... 23
Figure 8: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ...................... 23
Figure 9: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ...................... 23
Figure 10: Dimensions of the Receptacle (Unit: mm) ................................................................................ 24
Figure 11: Specifications of Mated Plugs .................................................................................................. 25
Figure 12: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 25
Figure 13: Placement and Fixing of the Heatsink ...................................................................................... 28
Figure 14: Top and Side Dimensions ......................................................................................................... 29
Figure 15: Bottom Dimensions (Bottom View) ........................................................................................... 30
Figure 16: Recommended Footprint .......................................................................................................... 31
Figure 17: Top and Bottom Views .............................................................................................................. 32
Figure 18: Recommended Reflow Soldering Thermal Profile ................................................................... 34
Figure 19: Carrier Tape Dimension Drawing ............................................................................................. 36
Figure 20: Plastic Reel Dimension Drawing .............................................................................................. 37
Figure 21: Mounting Direction .................................................................................................................... 37
Figure 22: Packaging Process ................................................................................................................... 38
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