Quectel M66

GSM/GPRS Module Series
M66 Hardware Design
M66_Hardware_Design Confidential / Released 68 / 80
6.2. Recommended Footprint
1
14
23
36
Figure 45: Recommended Footprint (Unit: mm)
1. The module should be kept about 3mm away from other components in the host PCB.
2. The circular test points with a radius of 1.75mm in the above recommended footprint should be
treated as keepout areas. (“keepout” means do not pour copper on the mother board).
NOTE
Quectel
Confidential