Quectel UG96 - Manufacturing and Packaging; Manufacturing and Soldering

HSPA/UMTS/GSM/GPRS Module Series
UG96&UG95&M95 R2.0 Compatible Design
UG96&UG95&M95 R2.0_Compatible_Design 36 / 42
6 Manufacturing and Packaging
6.1. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil is recommended to be 0.13mm for UG96/UG95 and 0.2mm for M95 R2.0. For more
details, please refer to document [6].
It is suggested that the peak reflow temperature is 240ºC ~245ºC, and the absolute maximum reflow
temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (°C)
Reflow Zone
Soak Zone
245
200
220
240
C
D
B
A
150
100
Max slope: 1~3°C/sec
Cooling down
slope: 1~4°C/sec
Max slope:
2~3°C/sec
Figure 25: Recommended Reflow Soldering Thermal Profile