Samsung CLP-610ND - Page 27

Samsung Electronics
Service Manual
Product spec and feature
2-18
1 DEVE BLDC MOTOR ,PICKUP CLUTCH 12 LSU BLDC MOTOR
2 OPC BLDC MOTOR 13 LSU Y,M
3 HUMIDITY_INNER TEMP SENSOR 14 SMPS
4 DEVE CRUM I/F 15 REAR FAN
5 USB 16 SMPS FAN
6 LAN 17 PANEL (for debug)
7 SCF 18 HVPS1(PANEL,EXIT,REGI,EMPTY SEN-
SOR, PICKUP)
8 DEBUG 19 HVPS2(HIGH VOLTAGE CONTROL)
9 LSU TEMP SENSOR (RESERVED) 20 24V INTERLOCK SWITCH
10 FUSER CONTROL 21 FUSER THERMISTOR
11 LSU C,K 22 FUSER STEP MOTOR, FUSER FAN
23 PTB (CRUM, ACR)
• CPU : CLP-610ND : Chorus3 (SoC)
CLP-660N/660ND : Mips 7065C 533MHz + SPGPXm
• Memory :
- RAM : CLP-610ND : DDR2 Default 128MB + Option 128MB/256MB
CLP -660N/660ND : DDR1 Default 128MB + Option 256MB/512MB
- ROM : 16MB
- EEPROM : 64kb
• Peripherals :
- USB 2.0
- 10/100 Based N/W (MII Interface Phy Chip Used)
• I/O :
- Digital I/O Port : Basic I/O, PWM : Motor & HVPS Control
- UART : Debug Only
- I
2
C : EEPROM & SDRAM & CRUM Interface
- Analog I/O Port (ADC : Sensor Interface, DAC : LD Power Control)
Chorus 3 Architecture
• CPU Core : ARM9266EJS 360Mhz (I-Cache : 16KB, D-Cache : 16KB)
• SDRAM Controller : 4 bank DDR1 SDRAM and 4 & 8 bank DDR2 SDRAM
(DDR2 2DIMM Used, 166MHz), 120Mhz System Bus
• ROM Controller : 2 Banks ( 1 Bank Used)
• I/O Controller : 4 Channel