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SICK SIG200

SICK SIG200
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Figure 3: Hardware catalog
7.1.1.2 Device Model
PROFINET devices are designed as a modular system. The system is composed of a top
module and several data modules. To configure the IO-Link Master, the relevant data
modules are assigned to a slot or subslot. The project planning software represents the
data modules broken down according to the slots. Within SIG200 the slots are struc‐
tured in the following way:
SIG200 CONFIGURATION 7
8017853/2019-06-06 | SICK O P E R A T I N G I N S T R U C T I O N | Sensor Integration Gateway - SIG200
13
Subject to change without notice

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