Siemens KNX EIB TP-UART 2-IC - Page 38

GAMMA instabus
Release: February 2012
KNX EIB TP-UART 2-IC
Technical Manual pages 42 Siemens AG
Infrastructure and Cities Sector,
Building Technologies
page 38 © Siemens AG 2012 Control Products and Systems
Subject to change without further notice. P. O. Box 10 09 53,
D-93009 Regensburg
6 Soldering Profile
Symbol Parameter Value Unit
Note
T
C
Classification Temperature 260 °C
T
smin
Temperature min 150 °C
Preheat/Soak
T
smax
Temperature max 200 °C
Preheat/Soak
t
S
Time 60-120 s
T
smin
to T
smax
T
L
to T
P
Ramp-up rate (T
L
to T
P
)
≤ 3
°C/s
T
L
Liquidous Temperature 217 °C
t
L
Time (t
L
) maintained above T
L
60-150 s
T
P
Peak package body temperature 260 °C
t
P
Time (t
P
) within 5 °C of the
specified classification temperature
(T
C
), see Figure 5-1
30 s
T
P
to T
L
Ramp-down rate (T
P
to T
L
)
≤ 6
°C/s
t
25
to t
P
Time 25 °C to peak temperature
≤ 8
min
Table 26 Soldering Profile
Figure 9 Soldering Profile
Moisture Sensitivity Level: 3
Maximum number of running a reflow profile: 3
Plating: pure tin (matte tin)