— 13 —
— 14 —
6-2. CIRCUIT BOARDS LOCATION
• Waveforms
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each
block.)
• Printed wiring boards.
• : parts extracted from the component side.
• : parts extracted from the conductor side.
• ® : Through hole.
• : Pattern from the side which enable seeing.
(The other layer's patterns are not indicated.)
• Schematic diagrams.
• All capacitors are in µF unless otherwise noted. pF : µµF 50WV
or less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and 1/4W or less unless otherwise speci-
fied.
• ¢ : internal component.
• : panel designation.
Note : The components identified by mark ! or dotted
line with mark ! are critical for safety.
Replace only with part number specified.
•
B+ : B+ Line
•
B– : B– Line
• Voltage and waveforms are dc with respect to ground under no-
signal conditions.
no mark : STOP
• Voltages are taken with a VOM (Input impedance 10MΩ).
Voltage variations may be noted due to normal production tol-
erances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tol-
erances.
• Circled numbers refer to waveforms.
• Signal path.
:CD
: digital out
BD board
LOADING board
POWER SW board
PANEL board
MAIN board
1
2
IC101 @¶ TE
APPROX 500mVp-p (PLAY)
2.5V
3
4
2.5V
APPROX 200mVp-p (PLAY)
IC101 @ª FE
5
2.6Vp-p
7.5 µsec
6
IC621 #¡ EXTAL
8MHz
7
IC661 6 384FS
IC661 0 BCK
8
IC661 @¡ XOUT
3.8Vp-p
4.8Vp-p
16.9MHz
2.1MHz
3.2Vp-p
33.8MHz
CDP-XE510
HP board
(PLAY)
IC101 #§ RFAC
1.3Vp-p
(PLAY)
IC101 (§ MDP
5Vp-p
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