Sony HCD-BC250 - PRINTED WIRING BOARD - PANEL;FL;POWER SW;H;P;AMP RETAINER SECTION -

2525
HCD-BC150/BC250
HCD-BC150/BC250
2-19. PRINTED WIRING BOARD — PANEL/FL/POWER SW/H/P/AMP RETAINER SECTION —
:Uses unleaded solder.
+
+
VOLUME
(FLUORESCENT INDICATOR TUBE)
PRESET
(DISC5)
DISC5
DISC5
DISC4
DISC3
DISC2
DISC1
DISC1
DISC2DISC3
DISC4
FUNCTION
-
-
(DISC4)
(DISC3)
(DISC2)
D816-821(BACK LIGHT)
(DISC1)
PHONES
STANDBY
(page 21)
CN503
BOARD
MAIN
I
(page 30)
CNP303
BOARD
AMP
K
IC803
IC800
IC802
182
5
1
5
3
2
EE
EE
E
EE
3
1
E
E
EE
12
A
B
C
D
E
F
G
345678
9 10 11 12 13
Ver 1.3
• See page 36 for Circuit Boards Location.
• Semiconductor Location
Ref. No. Location
D800 F-3
D801 F-3
D802 E-13
D803 B-4
D806 A-12
D807 A-11
D808 A-10
D809 A-9
D810 C-4
D811 C-5
D812 A-8
D813 C-5
Ref. No. Location
D814 C-5
D815 C-5
D816 B-11
D817 B-17
D818 B-9
D819 B-8
D820 B-11
D821 B-8
IC800 F-13
IC802 B-6
IC803 D-9
Ref. No. Location
Q800 F-3
Q801 F-4
Q803 F-4
Q804 F-4
Q806 B-6
Q807 B-7
Q808 C-4
Q814 E-10
Q815 E-9
Q820 B-8
Q821 B-9
Q822 B-11