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Sony HCD-GS30DAB - Page 54

Sony HCD-GS30DAB
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2
HCD-GS10/GS30DAB
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise
specified.
• f : internal component.
• 2 : nonflammable resistor.
• 5 : fusible resistor.
• C : panel designation.
• H : adjustment for repair.
• A : B+ Line.
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
No mark: FM
• Circled numbers refer to waveforms.
• Signal path.
F : TUNER (FM)
f : TUNER (AM)
J : CD
d : AUX
: AUDIO
•Abbreviation
AR : Argentine model
CND : Canadian model
E2 : 120V AC area in E model
E51 : Chilean and Peruvian models
MX : Mexican model
RU : Russian model
SP : Singapore model
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• f : internal component.
•
: Pattern from the side which enables seeing.
• Indication of transistor.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
B
These are omitted.
CE
Q
B
These are omitted.
CE
Q
DIAGRAMS
•Waveforms
– MAIN Board –
– PANEL Board ––
1 IC801 w; (XOUT)
13.3
µ
s
1.5 Vp-p
500 mV/DIV, 4
µ
s/DIV
1
IC701 qd (X0A/P90)
30.5
µ
s
2.2 Vp-p
500 mV/DIV, 10
µ
s/DIV
2
IC701 od (X0)
180 ns
3.3 Vp-p
1 V/DIV, 100 ns/DIV
Ver. 1.3
Note:
The components identi-
fied by mark 0 or dot-
ted line with mark 0 are
critical for safety.
Replace only with part
number specified.
Note:
Les composants identifiés
par une marque 0 sont cri-
tiques pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.