Sony HCD-GS30DAB - Page 70

2
HCD-GS10/GS30DAB
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise
specified.
• f : internal component.
• 2 : nonflammable resistor.
• 5 : fusible resistor.
• C : panel designation.
• H : adjustment for repair.
• A : B+ Line.
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
No mark: FM
• Signal path.
d : AUX
•Abbreviation
MX : Mexican model
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• f : internal component.
•
: Pattern from the side which enables seeing.
• Indication of transistor.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
B
These are omitted.
CE
Q
C
B
These are omitted.
E
Q
DIAGRAMS
Note:
The components identi-
fied by mark 0 or dot-
ted line with mark 0 are
critical for safety.
Replace only with part
number specified.
Note:
Les composants identifiés
par une marque 0 sont cri-
tiques pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
Ver. 1.3