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Sony XR3F-19B160 - Printed Wiring Boards and Schematic Notes

Sony XR3F-19B160
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88
2-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Schematic Diagram:
All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
All resistors are in and
1
/
4
W or less unless otherwise
specified.
¢
: internal component.
C : panel designation.
Note on Printed Wiring Board:
X : parts extracted from the component side.
Y : parts extracted from the conductor side.
r
: Through hole.
¢
: internal component.
b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
U : B+ Line.
Power voltage is dc 14.4V and fed with regulated dc power
supply from ACC and BATT cords.
Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
: Impossible to measure
Voltages are taken with a VOM (Input impedance 10 M).
Voltage variations may be noted due to normal produc-
tion tolerances.
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
Circled numbers refer to waveforms.
Signal path.
J : CD PLAY
Note: The components identified by mark ! or dotted line
with mark ! are critical for safety.
Replace only with part number specified.
Circuit Boards Location
KEY board
SIGNAL CONNECTOR board
POWER CONNECTOR board
MAIN board
MOTOR board
MD MAIN board
SENSOR board
Approx.
156 mVp-p
Waveforms (MD MAIN BOARD)
1 IC501 $™ (TEO)
2 IC501 1 (FEO)
Approx.
132 mVp-p
3 IC501 (RF O)
4 IC502 (LRCK)
Approx.
1.1 Vp-p
5 Vp-p
22
µ
s
5 IC502 @™ (BCK)
5 Vp-p
470 ns
6 IC601 (X2)
5 Vp-p
236 ns
7 IC301 5 (XTI)
3 Vp-p
59 ns

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