FEATURES
l DOUBLE SIDE PCB AND SMD COMPONENTS.
l FULL MOSFET DESIGN.
l LPF AND SUBSONIC CROSSOVER.
l ADJUSTABLE BASSBOOST LEVEL.
l ACTIVE X-OVER FUNCTION.
l HEAVY-DUTY ALUMINUM ALLOY HEATSINK.
l HIGH (Speaker) OR LOW (RCA) LEVEL INPUTS.
l OVERLOAD, OVERHEAT, HIGH/LOW VOLTAGE PROTECTION.
l RoHS COMPLIANT.
FEATURES
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