Operations Model 6DS-SP Planarizer
vi Version 4.0 - February 1998
BASIC OPERATION 38
Summary 38
Problems and Error Messages 38
1 - Power Up 39
2 - Perform Home Sequence Routine 40
3 - Place Carriers on Spindles 43
4 - Retrieve a Stored Recipe 46
5 - Run an Auto Polish Cycle 47
OPERATION USING MANUAL LOADING OF WAFERS 50
Summary 50
1 - Power Up 51
2 - Perform Home Sequence Routine 51
3 - Place Carriers on Spindles 51
4 - Retrieve a Stored Recipe 51
5 - Run an Auto Polish Cycle Using the “Start with Load” Feature 52
OPERATOR ROUTINE PREVENTIVE MAINTENANCE AND
ASSOCIATED PROCEDURES 54
Daily Preventive Maintenance Schedule 55
Slurry System Flush 56
Removal of Carriers from Spindles 60
Consumable Materials Servicing 62
Polishing Pad Removal and Installation 62
Wafer Backing Insert Change 64
Wafer Template Ring Change 66
Operation of a Table Conditioning Cycle Using the Conditioning
Arm 68
Operation of a Table Conditioning Cycle with Conditioning
Devices on
the Spindles 71
Operation of a Carrier Cleaning Cycle 74
Operation of a Spindle Flush Cycle 74
Heater/Chiller Operation 75
Heater/Chiller Control Unit and Temperature Display 75
Water Temperature Display on the 6DS-SP Status 75
CYCLE HALTING FUNCTIONS AND ASSOCIATED
PROCEDURES 76
Cycle Halt Button 77
During Polishing Phase of Auto Polish Cycle 77
During Robot Wafer Movement Phase of Auto Polish Cycle 77
“Finish” an Auto Polish Cycle 78
“Abort” an Auto Polish Cycle or Other Machine Motion 79
Open Door 80
Emerg Off Button 81
Procedure for Safe Removal of Wafer from Robot 82
CARRIER LOADING AND UNLOADING FOR MACHINES
EQUIPPED WITH A SECOND POLISH TABLE 84
Carrier Loading for the Two-Table Machine 84
Carrier Unloading for the Two-Table Machine 87
To Next Page
Loading...
