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Telit Wireless Solutions LE910C1-AP - Solder Reflow Profile

Telit Wireless Solutions LE910C1-AP
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LE910C1 Hardware User Guide
1VV0301298 Rev. 1.08 - 2017-11-14
Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved
Telit Confidential Information, provided under NDA Page
102 of 119
10.7. Solder Paste
We recommend using only “no clean” solder paste to avoid the cleaning of the modules after
assembly.
10.7.1. Solder Reflow
Figure 27 shows the recommended solder reflow profile.
Figure 27: Solder Reflow Profile

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