Telit Wireless Solutions LE910C1-AP - Mounting the Module on Your Board; Module Finishing and Dimensions

LE910C1 Hardware User Guide
1VV0301298 Rev. 1.08 - 2017-11-14
Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved
Telit Confidential Information, provided under NDA Page
96 of 119
10. Mounting the Module on your Board
10.1. General
The LE910C1 module was designed to be compliant with a standard lead-free SMT process.
10.2. Finishing & Dimensions
Figure 21 shows the mechanical dimensions of the LE910C1 module.
Figure 21: LE910C1 Mechanical Dimensions (bottom view)
Lead-free Alloy:
Surface finishing Ni/Au for all solder pads
4 x Route
Inhibit
Pin
B1