Telit Wireless Solutions ME910G1-WW - Solder Reflow

ME910G1 HW Design Guide
1VV0301593 Rev.7 Page 75 of 98 2021-02-02
Solder paste
Various types and grades of solder paste can be used for surface mounting Telit modules.
For leadfree applications, a Sn-Ag (SA) or Sn-Ag-Cu (SAC) solder paste can be used. Any
Type 3 solder paste that is either water-soluble or no clean is acceptable.
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
Solder Reflow
Recommended solder reflow profile:
Figure 30: Recommended solder reflow profile
Profile Feature
Pb-Free Assembly Free
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
Table 34: Profile feature recommendations