Texas Instruments DRV8833 - Page 27

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PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X
0.30
0.19
6.6
6.2
TYP
SEATING
PLANE
0.15
0.05
0.25
GAGE PLANE
0 -8
1.2 MAX
2X 0.95 MAX
NOTE 5
2X 0.23 MAX
NOTE 5
2.31
1.75
2.46
1.75
B
4.5
4.3
A
5.1
4.9
NOTE 3
0.75
0.50
(0.15) TYP
4X (0.3)
PowerPAD TSSOP - 1.2 mm max heightPWP0016C
SMALL OUTLINE PACKAGE
4224559/B 01/2019
1
8
9
16
0.1 C A B
PIN 1 INDEX
AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may differ or may not be present.
TM
PowerPAD is a trademark of Texas Instruments.
A 20
DETAIL A
TYPICAL
SCALE 2.500
THERMAL
PAD
1
8 9
16
17