Texas Instruments DRV8833 - Page 29

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EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
(2.31)
BASED ON
0.125 THICK
STENCIL
(2.46)
BASED ON
0.125 THICK
STENCIL
PowerPAD TSSOP - 1.2 mm max heightPWP0016C
SMALL OUTLINE PACKAGE
4224559/B 01/2019
2.08 X 1.950.175
2.25 X 2.110.15
2.46 X 2.31 (SHOWN)0.125
2.75 X 2.580.1
SOLDER STENCIL
OPENING
STENCIL
THICKNESS
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
TM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
8
9
16
METAL COVERED
BY SOLDER MASK
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
17