PREFIX
TMS
TMX =
experimental device
TMP =
prototype device
TMS =
qualified device
320
DEVICE FAMILY
320 = TMS320 MCU Family
F
TECHNOLOGY
F = Flash
28379D
DEVICE
28379D
28377D
28376D
28375D
28374D
28378D
PTP
PACKAGE TYPE
176
337-Ball ZWT New Fine Pitch Ball Grid Array (nFBGA)
-Pin PTP PowerPAD Thermally Enhanced Low-Profile Quad Flatpack (HLQFP)
100-Pin PZP PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP)
TEMPERATURE RANGE
T
−40°C to 105°C (T )
−40°C to 125°C (T )
−40°C to 125°C (T )
(Q refers to AEC Q100 qualification for automotive applications.)
J
J
A
T
S
Q
=
=
=
YMLLLLS
YM
LLLL
S
$$
#
G4
Lot Trace Code
2-Digit Year/Month Code
Assembly Lot
Assembly Site Code
Wafer Fab Code as applicable
Silicon Revision Code
Green (Low Halogen and RoHS-compliant)
=
=
=
=
=
=
=
$$#-YMLLLLS
G4
F28379DPTPT
TMS320
Package
Pin 1
Device Markings
www.ti.com
2
SPRZ412K–December 2013–Revised February 2020
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Copyright © 2013–2020, Texas Instruments Incorporated
TMS320F2837xD Dual-Core MCUs Silicon Revisions C, B, A, 0
3 Device Markings
Figure 1 provides an example of the 2837xD device markings and defines each of the markings. The
device revision can be determined by the symbols marked on the top of the package as shown in
Figure 1. Some prototype devices may have markings different from those illustrated. Figure 2 shows an
example of the device nomenclature.
Figure 1. Example of Device Markings
(1)
Silicon Revision ID
Table 1. Determining Silicon Revision From Lot Trace Code
SILICON REVISION CODE SILICON REVISION
REVID
(1)
Address: 0x5D00C
COMMENTS
Blank 0 0x0000 This silicon revision is available as TMX.
A A 0x0000 This silicon revision is available as TMX.
B B 0x0002 This silicon revision is available as TMX.
C C 0x0003 This silicon revision is available as TMS.
Figure 2. Example of Device Nomenclature
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