Following components soldered on the top side of the system board are extremely
sensitive. When you service the system board, avoid any kind of rough handling.
a Accelerometer chip for the HDD Active Protection System
b Security chip
c CPU
d Video chip
e MCH (Memory Controller Hub)
f ICH (I/O Controller Hub)
Bending or flexing the system board can cause ball grid array (BGA) connections
to crack (unzip).
a
b
c
d
e
f
Removing and replacing a FRU
ThinkPad T60 and T60p 111
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