TYAN S7105 - User Manual

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S7105

Version 1.0i

reserved. No part of this manual may be reproduced or translated without prior

written consent from MITAC COMPUTING TECHNOLOGY CORPORATION.

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following.

TYAN

is a trademark of MITAC COMPUTING TECHNOLOGY CORPORATION.

Intel

is a trademark of Intel

Corporation.

AMI, AMI BIOS are trademarks of AMI Technologies.

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or implied warranty, relating to sale and/or use of TYAN

products including liability

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The TYAN S7105 motherboard is a powerful computing platform designed to support dual Intel® Xeon Scalable processors. It leverages advanced Intel® technology to offer scalable 32 and 64-bit computing, high-bandwidth memory design, and lightning-fast PCI-E bus implementation, making it suitable for demanding IT environments and future application upgradeability.

Function Description:

The S7105 motherboard serves as the central component for a server system, providing the necessary infrastructure for processors, memory, expansion cards, storage, and network connectivity. It integrates a BIOS (Basic Input/Output System) for managing hardware interfaces and basic configuration settings, including advanced options for iSCSI, Intel® Virtual RAID on CPU (VMD), Trusted Computing, ACPI, S5 RTC Wake, Serial Port Console Redirection, PCI Subsystem, CSM, USB, Onboard Devices, Option ROM Dispatch Policy, NVDIMM ADR, AST2500 Super IO, Hardware Health, Platform Configuration, Processor, UPI, Memory, IIO, and Advanced Power Management. The board also includes diagnostic features like POST codes for troubleshooting and a BIOS recovery process.

Important Technical Specifications:

Processors: Supports dual LGA3647 sockets for Intel® Xeon Scalable Processors with a Thermal Design Power (TDP) of up to 205W. System Bus supports up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI).
Chipset: Intel C621 PCH.
Memory: Features (6)+(6) DIMM slots, supporting up to 384GB RDIMM / 768GB LRDIMM / 1,536GB RDIMM 3DS / LRDIMM 3DS DDR4 memory at speeds of 2933/2666 MHz, and Intel Optane DC Persistent Memory Modules (DCPMM). Memory voltage is 1.2V. DDR4-2933 speed is supported with 2nd Gen Intel Xeon Scalable Processors (Cascade Lake) in a 1 DIMM per channel configuration. DCPMM is supported with specific 2nd Gen Intel Xeon Scalable Processors.
Expansion Slots: Includes (1) PCI-E Gen3 x16 slot and (5) PCI-E Gen3 x16 slots.
LAN: Equipped with (2) 10GbE ports (Intel X550-AT2 controller) and (1) GbE port dedicated for IPMI (Realtek RTL8211E PHY).
Storage: Provides (2) SATA connectors (Intel C621 controller, 6.0 Gb/s, RAID 0/1/10/5 with Intel RSTe) and (2) Mini-SAS HD (8-ports) connectors for sSATA (Intel C621 controller, 6.0 Gb/s, RAID 0/1/10/5 with Intel RSTe). Also includes (2) M.2 connectors (2280/22110) by PCI-E interface.
Graphic: Features a D-Sub 15-pin VGA port (at rear) with a resolution of up to 1920x1200, powered by an Aspeed AST2500 chipset.
Input/Output: (2) USB3.0 ports (at rear), (1) Type-A USB3.0 port, (1) DB-9 COM Connector, (1) D-Sub 15-pin VGA port (at rear), (2) 10GbE RJ-45 ports, (1) Dedicated IPMI RJ-45 port, Audio (LINE_IN, LINE_OUT, MIC_IN connectors), (1) 2x12-pin SSI front panel header, (2) SATA-III connectors + (2) Mini-SAS (4-in-1) connectors, SSI 24-pin + 8-pin + 8-pin power connectors, and (1) UID button.
TPM (Optional): Supports TPM.
System Monitoring: Aspeed AST2500 chipset, (5) 4-pin fan headers, monitors CPU, memory, chipset, and system environment temperatures and voltages, includes over-temperature warning, fan & PSU fail LED indicators, and a watchdog timer.
Server Management: IPMI 2.0 compliant baseboard management controller (BMC) with AST2500 iKVM features (storage over IP, remote platform-flash, USB 2.0 virtual hub) and AST2500 IPMI features (24-bit high quality video compression, 10/100/1000 Mb/s MAC interface).
BIOS: AMI, 32MB ROM size, features Hardware Monitor, SMBIOS 3.0/PnP/Wake on LAN, Boot from USB device/PXE via LAN/Storage, User Configurable FAN PWM Duty Cycle, Console Redirection, ACPI sleeping states S4,S5, ACPI 6.1.
Physical Dimension: Proprietary form factor, 14.2" x 13.2" (361.5 x 336.2mm).
Operating Environment: Operating Temp: 10°C ~ 35°C (50°F ~ 95°F), Non-operating Temp: -40°C ~ 70°C (-40°F ~ 158°F), In/Non-operating Humidity: 90%, non-condensing at 35°C.
Regulation: FCC (DoC) Class B, CE (DoC) Class A.

Usage Features:

Processor Installation: Detailed steps for installing LGA3647 processors and heatsinks, including torque specifications for mounting screws (5~7 kgf/cm or 4.35~6.09 lb/in) and instructions for applying thermal grease.
Memory Installation: Supports various DDR4 DIMM types (RDIMM, 3DS-RDIMM, LRDIMM, 3DS-LRDIMM, DCPMM). Emphasizes using paired memory for maximum performance, populating the same DIMM type and size per channel, and installing with CPU0 Socket first. Provides a comprehensive memory population table for single and dual CPU configurations.
DCPMM Support: Specific guidelines for Intel Optane DC Persistent Memory Module installation, including processor compatibility, same size for all DCPMMs, balancing memory channels, and minimum/maximum per processor.
Drive Cable Attachment: Simple Serial ATA (SATA) connections with no need for Master/Slave jumpers.
Add-In Card Installation: Diagrams for PCI-E x16 and x8 slots, recommending staggered installation for better airflow.
External Device Connectivity: Clear diagrams for connecting external devices to various ports (USB, LAN, VGA, Audio).
Power Supply Installation: Supports EPS 12V power supply with three power connectors (24-pin ATX, two 8-pin ATX).
BIOS Setup Utility: User-friendly interface for configuring system settings, including navigation keys and help functions. Allows for advanced configuration of various components and features.
iSCSI Configuration: Instructions for initiating iSCSI function, including setting initiator name, internet protocol, connection retry count, and authentication type.
Intel® Virtual RAID on CPU (VMD): Steps to initiate VMD function and configure VMD for volume management devices on specific PCI-E slots.
Secure Boot: Options for enabling/disabling secure boot, selecting boot mode (Standard/Custom), and managing keys (provisioning factory defaults, installing keys, enrolling EFI images, saving variables, platform key, key exchange keys, authorized signatures, forbidden signatures, authorized timestamps, OS recovery signatures).

Maintenance Features:

BIOS Updates: Users are encouraged to visit the TYAN website for the latest BIOS updates, drivers, and supporting documentation.
BIOS Recovery: A dedicated process for recovering the UEFI BIOS in case of failure or corruption, involving a USB disk and specific key combinations during boot.
Troubleshooting: Provides a diagnostic checklist (Memory, Video, CPU) and refers users to the TYAN website for more information on troubleshooting and Flash Utilities.
POST Codes: Detailed AMIBIOS Post Codes (Aptio) for diagnosing issues during the BIOS pre-boot process, categorized by checkpoint ranges, SEC phase, PEI phase, S3 Resume, DXE phase, and ACPI/ASL checkpoints, along with corresponding beep codes.
Fan and Temp Sensors: Identification of fan and temperature sensor locations on the motherboard and a table explaining BIOS temperature sensor names for monitoring CPU, PCH, system air inlets/outlets, SAS chip, MOSFETs, and DIMM areas.
Warranty and Support: Emphasizes contacting the dealer first for product problems and provides TYAN's help resources, including FAQs, bulletins, driver updates, and online support.
Battery Information: Caution regarding the lithium battery, advising against puncturing, mutilating, or disposing of it in fire, and recommending replacement with the same or equivalent type.