u-blox LEA-6 Series Hardware Integration Manual

LEA-6 / NEO-6 - Hardware Integration Manual
GPS.G6-HW-09007-A Preliminary Design-in
Page 25 of 62
Function PIN No I/O Description Remarks
System TIMEPULSE 3 O Timepulse
Signal
Configurable Timepulse signal (one pulse per second by default).
Leave open if not used.
EXTINT0 4 I External
Interrupt
External Interrupt Pin.
Internal pull-up resistor to VCC. Leave open if not used.
SDA2 18 I/O DDC Pins DDC Data. Leave open, if not used.
SCL2 19 I/O DDC Pins DDC Clock. Leave open, if not used.
Reserved 17 I Reserved Leave open
CFG_COM1
/MISO
15 I/O Config. Pin
/SPI MISO
Leave open if not used.
CFG_COM0
/MOSI
14 I/O Config. Pin
/SPI MOSI
Leave open if not used.
Note Connect to GND to use USB in Self Powered mode. See
Section 1.7.4 and the NEO-6 Data Sheet [2]
Reserved 8 I Reserved Leave open.
Reserved 1 - Reserved Leave open.
SS_N 2 I/O SPI Select Leave open if not used.
CFG_GPS0
/SCK
16 I/O Config. Pin
/SPI SCK
Leave open if not used.
Table 5: Pinout NEO-6
2.4 Layout
This section provides important information for designing a reliable and sensitive GPS system.
GPS signals at the surface of the Earth are about 15dB below the thermal noise floor. Signal loss at the antenna
and the RF connection must be minimized as much as possible. When defining a GPS receiver layout, the
placement of the antenna with respect to the receiver, as well as grounding, shielding and jamming from other
digital devices are crucial issues and need to be considered very carefully.
2.4.1 Footprint and paste mask
Figure 14 - Figure 17 describe the footprint and provide recommendations for the paste mask for LEA-6 and
NEO-6 modules. These are recommendations only and not specifications. Note that the Copper and Solder
masks have the same size and position.
To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the
volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent)
extending beyond the Copper mask. The solder paste should have a total thickness of 170 to 200 µm.
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u-blox LEA-6 Series Specifications

General

Brand	u-blox
Model	LEA-6 Series
Category	GPS
Language	English