LEA-6 / NEO-6 - Hardware Integration Manual
GPS.G6-HW-09007-A Preliminary Contents
Page 6 of 62
2.5.2 Active antenna (LEA-6) ................................................................................................................ 31
2.5.3 Active antenna (NEO-6) ............................................................................................................... 32
2.5.4 Active antenna bias power (LEA-6) .............................................................................................. 33
2.5.5 Active antenna supervisor (LEA-6)................................................................................................ 33
3 Product handling ........................................................................................................ 38
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 38
3.2 Soldering ............................................................................................................................................ 38
3.2.1 Soldering paste............................................................................................................................ 38
3.2.2 Reflow soldering ......................................................................................................................... 38
3.2.3 Optical inspection ........................................................................................................................ 39
3.2.4 Cleaning ...................................................................................................................................... 40
3.2.5 Repeated reflow soldering ........................................................................................................... 40
3.2.6 Wave soldering............................................................................................................................ 40
3.2.7 Hand soldering ............................................................................................................................ 40
3.2.8 Rework ........................................................................................................................................ 40
3.2.9 Conformal coating ...................................................................................................................... 40
3.2.10 Casting ........................................................................................................................................ 40
3.2.11 Grounding metal covers .............................................................................................................. 41
3.2.12 Use of ultrasonic processes .......................................................................................................... 41
3.3 EOS/ESD/EMI Precautions .................................................................................................................... 41
3.3.1 Abbreviations .............................................................................................................................. 41
3.3.2 Electrostatic discharge (ESD) ........................................................................................................ 41
3.3.3 ESD handling precautions ............................................................................................................ 41
3.3.4 ESD protection measures ............................................................................................................. 42
3.3.5 Electrical Overstress (EOS) ............................................................................................................ 43
3.3.6 EOS protection measures ............................................................................................................. 43
3.3.7 Electromagnetic interference (EMI) .............................................................................................. 43
3.3.8 GSM applications ........................................................................................................................ 44
3.3.9 Recommended parts ................................................................................................................... 46
4 Product testing ........................................................................................................... 47
4.1 u-blox in-series production test ........................................................................................................... 47
4.2 Test parameters for OEM manufacturer .............................................................................................. 47
4.3 System sensitivity test ......................................................................................................................... 48
4.3.1 Guidelines for sensitivity tests ...................................................................................................... 48
4.3.2 ‘Go/No go’ tests for integrated devices ........................................................................................ 48
Appendix .......................................................................................................................... 49
A Abbreviations ............................................................................................................. 49
B Migration to u-blox-6 receivers ................................................................................. 49
B.1 Checklist for migration ....................................................................................................................... 49
B.2 Software migration ............................................................................................................................. 51
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