Ublox SARA-R5 Series - Starting Up; Overview of EVK-R5

SARA-R5 series - System integration manual
UBX-19041356 - R04 Contents Page 4 of 118
C1-Public
2.4.2 Cellular antenna RF interface (ANT) ............................................................................................. 59
2.4.3 GNSS antenna RF interface (ANT_GNSS) ................................................................................... 65
2.4.4 Cellular and GNSS RF coexistence ................................................................................................ 69
2.4.5 Cellular antenna detection interface (ANT_DET) ...................................................................... 72
2.4.6 Cellular antenna dynamic tuning control interface ................................................................... 74
2.5 SIM interface .............................................................................................................................................. 76
2.5.1 Guidelines for SIM circuit design ................................................................................................... 76
2.5.2 Guidelines for SIM layout design .................................................................................................. 80
2.6 Data communication interfaces ............................................................................................................ 81
2.6.1 UART interfaces ................................................................................................................................ 81
2.6.2 USB interface ..................................................................................................................................... 88
2.6.3 SPI interfaces .................................................................................................................................... 88
2.6.4 SDIO interface ................................................................................................................................... 89
2.6.5 DDC (I2C) interface ........................................................................................................................... 89
2.7 Audio ............................................................................................................................................................ 91
2.8 General purpose input / output (GPIO) ................................................................................................. 92
2.8.1 Guidelines for GPIO circuit design ................................................................................................. 92
2.8.2 Guidelines for general purpose input/output layout design .................................................... 93
2.9 Reserved pin (RSVD) ................................................................................................................................ 93
2.10 Module placement .................................................................................................................................... 93
2.11 Module footprint and paste mask ......................................................................................................... 94
2.12 Schematic for SARA-R5 series module integration .......................................................................... 95
2.13 Design-in checklist .................................................................................................................................... 96
2.13.1 Schematic checklist ......................................................................................................................... 96
2.13.2 Layout checklist ................................................................................................................................ 97
2.13.3 Antennas checklist ........................................................................................................................... 97
3 Handling and soldering ..................................................................................................................... 98
3.1 Packaging, shipping, storage and moisture preconditioning .......................................................... 98
3.2 Handling ...................................................................................................................................................... 98
3.3 Soldering ..................................................................................................................................................... 99
3.3.1 Soldering paste ................................................................................................................................. 99
3.3.2 Reflow soldering ................................................................................................................................ 99
3.3.3 Optical inspection ........................................................................................................................... 100
3.3.4 Cleaning ............................................................................................................................................ 100
3.3.5 Repeated reflow soldering ............................................................................................................. 101
3.3.6 Wave soldering ................................................................................................................................. 101
3.3.7 Hand soldering ................................................................................................................................. 101
3.3.8 Rework ............................................................................................................................................... 101
3.3.9 Conformal coating ........................................................................................................................... 101
3.3.10 Casting ............................................................................................................................................... 101
3.3.11 Grounding metal covers ................................................................................................................ 102
3.3.12 Use of ultrasonic processes ......................................................................................................... 102