Doc. No: Unex-QSG-21-003
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providing evidence for the tamper signal detection.
9.11. Thermal Management
If performing heavy V2X transmission on SOM-352, it is recommended to add thermal
vias and expose bare copper top layer on the system board to help disperse heat. Inserting
a soft silicone thermally conductive pad between the system board and SOM-352 could
facilitate heat dispersion to the system board more efficiently.
Figure 10: Thermally conductive pad area
9.12. Firmware Upgrade
9.12.1. Manual control
When the mPCIe Pin 46 (BOOTSTRP) is left unconnected (floating) or connected to
ground, the BOOT_SW (SW1.8) controls the boot mode. See TABLE 11: DIP SWITCH
FUNCTIONS for more details.
• BOOT_SW ON: Normal boot (boot from NAND)
• BOOT_SW OFF: Firmware upgrade (boot from USB0, DFU mode)
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