1.4 - HAZARDS
Installation Guide myReflow
CHAPTER 1 3
1.4 HAZARDS
1.4.1 FLUX VAPOURS
The solderpaste used on the printed circuit boards mainly consists of tin, lead and flux.
Repeatedly inhaling this vapours can cause health problems in the long term.
When the board is heated, a noxious vapour will be liberated. This vapour must be extracted.
To avoid inhalation of this vapours, wear mouth protection when working on the machine.
• When large amounts of this vapours are inhaling or ingested, contact a physician immedi-
ately. Always follow the first aid procedures described in the Material Safety Data Sheet
from the flux.
• When small amounts are inhaled, seek fresh air.
• Be sure that the exhaust system works properly.
• Never eat, drink or smoke while working on the machine.
• Wash hands after handling flux.
1.4.2 HOT SURFACES
There is always a risk of being burned when you work around the machine. Hot surfaces can
cause burns.
• Always wear heat resistant gloves and protective clothing when working on the machine.
• Never handle the finished boards without wearing protective gloves.
• If possible allow the machine time to cool down before you start servicing.
• When burned, immerse in cold water immediately. When the burn is severe consult a physi-
cian as soon as possible.
• Most of the components in the soldering system don’t look hot. Always assume that all parts
are hot.
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