ADT 7100 User Manual Troubleshooting
4.4 PIECES FLY OFF DURING DICING
This is a common situation when working with materials that have poor adhesion due to lack
of cleanliness or the type of material itself. Next, you can find some suggestions to try to
alleviate this problem.
1. The surface on contact with the mounting tape must be clean and free of contaminants.
Be sure you don’t have bubbles trapped between the tape and the sample; they indicate
not having a clean sample. You could try remounting the sample if you observed bubbles.
2. After mounting, put the mounted wafer back on the mounting station with the wafer
facing up for at least 15 minutes. The longer you heat the tape, the better the adhesion.
3. After removing the wafer from the mounting station, wait for it to cool completely. You
may use an air gun to cool it before placing it on the dicing saw chuck. Leaving it to cure
longer will help tape adhesion.
4. Reduce the feed rate parameter in the recipe.
5. Lower the cooling water flow.
6. Consider mounting your sample on a carrier wafer. You will need to request staff
assistance to discuss this possibility.
From Area Array Interconnection Handbook Page 203 edited by Karl J. Puttlitz, Paul A.
Totta
a. During mounting, any Interface gaps or areas of contamination would result in die loss
from the tape during cutting which would cause damage to the dicing blade and other
chips.
b. There are other established manufacturing practices in dicing to optimize tape
performance. For example, it is preferable to stretch the tape radially onto the mounting
frame before wafer placement. Mounted wafers are typically allowed to "age" for a
minimum of two hours before dicing to relax stresses in the tape and reduce "fly-off.”
However, diced chips left on the dicing tape for prolonged periods also become
challenging to remove because the bonding of the adhesive gets stronger; therefore,
there are time restrictions between dicing and picking.
Lurie Nanofabrication Facility 4-4
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