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7. Assembly OP ENG
7.1 Assemble “Baffle DMD” to “HSG DMD” (Fig.7-1).
7.2 Assemble “Sponge DMD” to “HSG DMD” (Fig.7-1).
7.3 Assemble Chip B/D Module to “HSG DMD” (Fig. 7-2).
Fig.7-2-1 Fig. 7-2-2
7.4 Assemble Thermal Pad & Gasket Hest-sink then place contact DMD (Fig. 7-3,7-3-1).
1.>Press center of Heatsink before assemble spring screw.
then keeps press until spring screw assembly finish.
2.>Pre-fastening Sequence: [ 1 ] - [ 2 ] - [ 3 ] - [ 4 ].
3.>Fastening Sequence: [ 2 ] - [ 1 ] - [ 4 ] - [ 3 ].
4.>Screw Torque must be confirmed to be 6 kg-cm.
Fixed shafts of
DMD HSG
Fixed holes of DMD
Baffle DMD
Sponge DMD
Alignment keying
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