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Discusses power supply configurations and voltage tolerance for digital inputs/outputs.
Power pin for digital I/O buffers, accepts 3.3V or 2.5V signaling.
Voltage regulator input pins for 3.3V systems. Left unconnected for 2.5V.
Power for internal digital core, requires external 2.5V supply in 2.5V systems.
Power for internal analog circuitry, requires external 2.5V supply in 2.5V systems.
Power for internal bias circuitry, always connect to AVDD.
Prioritizes placement of power supply filter components, transmit, and receive termination resistors.
Recommends TD+/- trace routing with matched length and 100Ω differential impedance.
Describes transmit drive architecture and signaling for 100Base-TX and 10Base-T.
Recommends RD+/- trace routing with 100Ω differential impedance and matched length.
Advises minimizing crystal clock trace length to reduce noise and instability.
Recommends grounded shielded RJ45-8 connectors and inner layers for routing.
Suggests placing component pads across chassis ground void to reduce EMI emissions.
Discusses power supply configurations and voltage tolerance for digital inputs/outputs.
Power pin for digital I/O buffers, accepts 3.3V or 2.5V signaling.
Voltage regulator input pins for 3.3V systems. Left unconnected for 2.5V.
Power for internal digital core, requires external 2.5V supply in 2.5V systems.
Power for internal analog circuitry, requires external 2.5V supply in 2.5V systems.
Power for internal bias circuitry, always connect to AVDD.
Prioritizes placement of power supply filter components, transmit, and receive termination resistors.
Recommends TD+/- trace routing with matched length and 100Ω differential impedance.
Describes transmit drive architecture and signaling for 100Base-TX and 10Base-T.
Recommends RD+/- trace routing with 100Ω differential impedance and matched length.
Advises minimizing crystal clock trace length to reduce noise and instability.
Recommends grounded shielded RJ45-8 connectors and inner layers for routing.
Suggests placing component pads across chassis ground void to reduce EMI emissions.
General| Brand | Broadcom |
|---|---|
| Model | BCM5221 |
| Category | Transceiver |
| Language | English |
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