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OPERATION
OPERATION
#415-R1
8-15-18 - JR
2) The second reason that would make a rip solution unacceptable concerns the
quality of the board being ripped, specically the relationship between the position
of defects and the quality requirements of the various rip widths being produced. If
after positioning a board under the laser lines, defect locations on the board surface
make this choice undesirable, the board should be rst ipped over to determine
if inverting the pattern on the board makes this original and optimum rip solution
acceptable for immediate feeding. Should this pattern remain undesirable the use
of the "Next Pattern" operator input switch is desirable as the next most valuable
solution is then calculated and presented on the board.
This next best solution is based on the combination of saws which results in the next
highest product value of the combined rips. These alternatives calculated by the "Next
Pattern" switch are presented in order of descending value and NOT in order of descending
dimensional yield. It is very possible that this next solution is actually wider than the
previous solution and of a higher board yield while the value has declined.
If the proposed combination is still unacceptable, the board should be again ipped over
to examine the rip pattern on the reverse side of the board before going to the third best
rip solution. By comparing the proposed rip solutions to both sides of the board, you are
greatly increasing the opportunity to use the highest valued saw combinations.
It is also suggested that the operator concentrate his (or her) attention on the laser line
projection of the rip pattern rather than the computer display. The operation screen was
designed to provide information regarding the status of the production run and not as a
guidance system for the operator.
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