Compaq Deskpro Workstation AP230 - Figure 2-10. Processor Assembly; Processors

Chapter 2 System Overview
Compaq Deskpro Personal Computers
Third Edition – April 2001
2-14
2.4.1 PROCESSORS
The Compaq Deskpro EN Series include models based on Celeron and Pentium III processors. All
Compaq Deskpro Workstation AP230 models feature the Pentium III processor. These processors
are backward-compatible with software written for the Pentium II, Pentium MMX, Pentium Pro,
Pentium, and x86 microprocessors. Both processor architectures include a floating-point unit, first
and secondary caches, and enhanced performance for multimedia applications through the use of
multimedia extension (MMX) instructions.
These systems employ a PGA370 zero-insertion-force (ZIF) socket designed for mounting a “Flip-
Chip” (FC-PGA370) processor package (Figure 2-10).
Figure 2–10. Processor Assembly And Mounting
The PGA370 socket allows easy changing/upgrading of the processor. Raising the Lock/Unlock
handle of the socket in the vertical position allows the processor package to be removed or
inserted into the socket. Lowering the Lock/Unlock handle in the down (horizontal) position locks
the processor package in place. These systems support processors fitted with passive heat sink or
processor fitted with a heat sink/fan assembly with a power cable that attaches to a fan-power
header provided on the system board.
NOTE: These systems support processors using the FC-PGA370 package only.The
PPGA370 package, while physically installable, will not work in these systems.
FC-PGA370
Package
PGA370
Socket
Heat Sink
Retaining Clip
Lock/Unlock
Handle
(Shown in unlock position)
Heat Sink for
GHz Processors
Heat Sink
Retaining Bar
Heat Sink for
MHz Processors