Technical Reference Guide
Compaq Deskpro Personal Computers
Third Edition - April 2001
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i
TABLE OF CONTENTS
CHAPTER 1 INTRODUCTION....................................................................................................................
1.1 ABOUT THIS GUIDE..................................................................................................................1-1
1.1.1 ONLINE VIEWING..............................................................................................................1-1
1.1.2 HARDCOPY ..........................................................................................................................1-2
1.2 ADDITIONAL INFORMATION SOURCES ..............................................................................1-2
1.3 MODEL NUMBERING CONVENTION....................................................................................1-2
1.4 SERIAL NUMBER ......................................................................................................................1-2
1.5 NOTATIONAL CONVENTIONS................................................................................................1-3
1.5.1 VALUES ...............................................................................................................................1-3
1.5.2 RANGES ...............................................................................................................................1-3
1.5.3 REGISTER NOTATION AND USAGE ..............................................................................1-3
1.5.4 BIT NOTATION...................................................................................................................1-3
1.6 COMMON ACRONYMS AND ABBREVIATIONS..................................................................1-4
CHAPTER 2 SYSTEM OVERVIEW............................................................................................................
2.1 INTRODUCTION.........................................................................................................................2-1
2.2 FEATURES AND OPTIONS .......................................................................................................2-2
2.2.1 STANDARD FEATURES ....................................................................................................2-2
2.2.2 OPTIONS ..............................................................................................................................2-3
2.3 MECHANICAL DESIGN.............................................................................................................2-4
2.3.1 CABINET LAYOUTS ..........................................................................................................2-5
2.3.2 CHASSIS LAYOUTS...........................................................................................................2-7
2.3.3 BOARD LAYOUTS............................................................................................................2-10
2.4 SYSTEM ARCHITECTURE......................................................................................................2-12
2.4.1 PROCESSORS....................................................................................................................2-14
2.4.2 CHIPSET.............................................................................................................................2-16
2.4.3 SUPPORT COMPONENTS................................................................................................2-16
2.4.4 SYSTEM MEMORY ..........................................................................................................2-17
2.4.5 MASS STORAGE...............................................................................................................2-17
2.4.6 SERIAL AND PARALLEL INTERFACES.......................................................................2-17
2.4.7 UNIVERSAL SERIAL BUS INTERFACE........................................................................2-17
2.4.8 NETWORK INTERFACE CONTROLLER.......................................................................2-17
2.4.9 GRAPHICS SUBSYSTEM.................................................................................................2-18
2.4.10 AUDIO SUBSYSTEM........................................................................................................2-19
2.5 SPECIFICATIONS .....................................................................................................................2-19
CHAPTER 3 PROCESSOR/MEMORY SUBSYSTEM..............................................................................
3.1 INTRODUCTION.........................................................................................................................3-1
3.2 PROCESSOR ................................................................................................................................3-2
3.2.1 CELERON PROCESSOR.....................................................................................................3-2
3.2.2 PENTIUM III PROCESSOR.................................................................................................3-3
3.2.3 PROCESSOR UPGRADING................................................................................................3-4
3.3 MEMORY SUBSYSTEM.............................................................................................................3-5
3.4 SUBSYSTEM CONFIGURATION..............................................................................................3-8