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Figure 2 Principle of direct detection.
A DECTRIS hybrid pixel detector is composed of a silicon sensor, which is a
two-dimensional array of pn-diodes processed in high-resistivity silicon,
connected to an array of readout channels designed with advanced CMOS
technology (Figure 3). Each readout channel is connected to its corresponding
detecting element through a microscopic indium ball, with a typical diameter of
18 um. This connection process is called ‘bump-bonding’.
Figure 3 The detector module, the basic element of all DECTRIS detector systems
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