Denon DVD-5000 - Page 39

aa I A A A I SE IE a I a I a aS I a CREE Err OV O-SOOO Bm
[| Ret.No. | PartNo. | PartName | _Remarks ||| Ref.No. | PartNo. | PartName | _ Remarks _| | RefNo. | PartNo. | PartName | __Remarks || Ref.No. | PartNo. | __PartName | Remarks [aity|
C820 254 4262 946 | Electrolytic 474F/63V CE04W1J470M i
R565,566 | 247 0006 962| Carbon chip 4700hm 1/10W =| RM73B--471J C531 254 4254 912 | Electrolytic 22uF/16V CE04W1C220M
R567 247 0018 905 | Carbon chip Oohm 1/10W RM73B-OROK C532 254 4250 767 | Electrolytic 1000uF/6.3V CE04W0J102M
R570 247 0011 944 | Carbon chip 47kohm 1/10W =| RM73B--473J C533 257 0011 909 | Ceramic chip 0.01,F/25V CK73B1E103K
CE04W1H330M
CK73B1H103K
254 4261 905
257 0010 900
C821,822
C823,824
Electrolytic 332F/50V
Ceramic chip 0.01pF/50V
R571 247 0011 928| Carbon chip 39kohm 1/10W | RM73B-393J C534 254 4252 943 | Electrolytic 220uF/10V CE04W1A221M C825 254 4256 790] Electrolytic 2200uF/25V CE04W1E222M
R572 247 0007 945] Carbon chip tkohm 10W | RM73B-102J C535 257 0002 963 | Ceramic chip 15pF/50V CC73SL1H150J 826,827 | 257 0010 900} Ceramic chip 0.01uF/S0V | CK73B1H103K
R573 247 0011 944 | Carbon chip 47kohm 1/10W — | RM73B--473J 536,537 | 257 0011 909 | Ceramic chip 0.01,.F/25V CK73B1E103K C828 255 4235 934 | Polypropylene film 0.01uF/100V | CQ93P2A103J(NH)
R574 247 0018 905 Carbon chip Oohm 1/10W RM73B--OROK C538 254 4254 954 | Electrolytic 220WF/16V CE04W1C221M C829 254 4532 702 Electrolytic 22000nF/10V CE04W1A223M(SMG)
R575 247 0013 942 | Carbon chip 330kohm 1/10W | RM73B-334J C539 257 0011 909 | Ceramic chip 0.01yF/25V | CK73B1E103K C830 254 4256 787 | Electrolytic 1000uF/25V CE04W1E102M FB501~505| 235 0049 900| Beads inductor
€831~834 | 257 0010900] Ceramic chip 0.01uF/50V —_| CK73B1H103K FB507~510| 235 0049 900] Beads inductor
R576 247 0011 944 | Carbon chip 47kohm 1/10W =| RM73B-473J C540 254 4250 932 | Electrolytic 220.F/6.3V CE04W0J221M
R577 247 0018 905 | Carbon chip Oohm 1/10W RM73B-OROK C541 254 4302 932 | Electrolytic 22uF/10V CE04W1A220M(SRE)
R578 247 0006 962| Carbon chip 470kohm 1/10W =| RM73B-471J C542 254 4250 932 | Electrolytic 2204F/6.3V CE04W0J221M
FF801,802| 202 0040 909
FH801,802} 202 0040 909
CK45F1H103Z
CK73B1H103K
Fuse clip
Fuse clip
253 1181 904
257 0010 900
C835~838 Ceramic 0.01pF/50V
Ceramic chip 0.01,F/50V
R579 247 0006 962| Carbon chip 4700hm 1/10W | RM73B--471J C543 254 4302 932 | Electrolytic 22uF/10V CE04W1A220M(SRE) 254 4302 974 | Electrolytic 100nF/10V CE04W1A101M(SRE) JKS01,502 | 204 8417 006) 1P pin jack (S-GND)
R580,581 | 247 0018 905 | Carbon chip Oohm 1/10W RM73B-OROK 544,545 | 247 0018 905 | Carbon chip Oohm 1/10W RM73B--OROK 257 0010 900} Ceramic chip 0.01,F/S0V CK73B1H103K JK503 | 269 0172 003] GP1F37R
R582,583 | 247 0004 977| Carbon chip 750hm 1/10W | RM73B-750J 546,547 | 257 0011 909 | Ceramic chip 0.01F/25V ‘| CK73B1E103K 254 4302 974 | Electrolytic 100,F/10V CE04W1A101M(SRE) JK504 269 0098 006] GP1F32T (OPT. OUT)
R587 247 0006 962 Carbon chip 4700hm 1/10W | RM73B-471J 549 257 0011 996 | Ceramic chip 0.1,F/25V CK73B1E104K 257 0010 900| Ceramic chip 0.01uF/S0V =| CK73B1H103K JK505,506 | 204 8260 004] Mini jack
R588 247 0012 998 | Carbon chip 200kohm 1/10W | RM73B-204J C550 257 0007 900 | Ceramic chip 1000pF/50V ‘| CC73SL1H102J 254 4302 974 | Electrolytic 100uF/10V CE04W1A101M(SRE) JK507 | 203 8494 000} 2P pin jack
R590 244 2052 928 | Metal oxide 47ohm 1W RS14B3A470JNBS(S) C551~554 | 257 0011 909 | Ceramic chip 0.01uF/25V ‘| CK73B1E103K 253 8014 702| Ceramic 0.01yF/400V(AC) | CK45F2GAC103MC J} = JK508 =| _-204 8572 006] 1P pin jack (G)
255 4235 934 | Polypropylene film 0.01uF/100V | CQ93P2A103U(NH) JK509 | 205 1089007] S-terminal
R591 247 0018 905 | Carbon chip Oohm 1/10W RM73B-0ROK C555 257 0007 900 | Ceramic chip 1000pF/SOV CC73SL1H102J
R593 247 0018 905 | Carbon chip Oohm 1/10W RM73B-OROK C556 257 0011 909 | Ceramic chip 0.01.F/25V CK73B1E103K
R596, 598 | 247 0007 945 | Carbon chip ikohm 1/10W RM73B-102J C557 257 0007 900 | Ceramic chip 1000pF/50V CC73SL1H102J
C861~864 | 254 4305 968 JK510 204 8573 005} 2P pin jack (R,B)
C865~868 | 254 4461 718
Electrolytic 141F/50V
Electrolytic 4.7uF/50V
CEO4W1HO10M(SRE)
CEO4W1H4R7M(ARS)
235 0070 911
558,559 | 257 0011 909 | Ceramic chip 0.01uF/25V | CK73B1E103K 501,502 Inductor 22H
560 | 257.0005 902 | Ceramic chip 1809F/60V | CC7SSLIHTS1J Seas Sin GG = - we ch Inductor 8.2uH
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CC73SL1H150J
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Ceramic
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47pF/50V
CC73SL1H470J
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C568
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254.4313
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Electrolytic
10uF/50V
CEO4W1H100M(ASF)
257
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Ceramic
chip
0.01uF/25V
|
CK73B1E103K
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203 4741 003 L=110
3P EH-SCN connector cord
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257
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996
|
Ceramic
chip O.1yF/25V
|
CK73B1E104K
254
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951
|
Electrolytic 2.2uF/50V
CE04W1H2R2M
mine
205
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3P EH
connector
base
(BK)
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C571 257 0011 909 |
Ceramic chip
0.01yF/25V
‘|
CK73B1E103K
257
0004
945 |
Ceramic
chip
82pF/50V
CC73SL1H820J
eae
205 1093
006} 2P
VH
connector
base
C573 257 0011 909
|
Ceramic
chip 0.01yF/25V
‘|
CK73B1E103K
254
4260
948
|
Electrolytic
11F/50V
CE04W1HO10M
as
205
0581
069]
2P
VH-VH
connector
base
205
1034
007]
M3
Screw
terminal
Ligh
C574 257
0007 900
|
Ceramic chip
1000pF/50V
|
CC73SL1H102J
257
0011
909| Ceramic chip
0.01:F/25V
|
CK73B1E103K
he
205
0233
032} 3P
EH
connector
base
C575
257 0011 909
|
Ceramic chip 0.01yF/25V
‘|
CK73B1E103K
254
4254
925
|
Electrolytic
33F/16V
CE04W1C330M
wane
205
0277
043]
4P
EH
connector
base
(RD)
205
1034
007|
M3
Screw
terminal
Gighs
C576 257 0007 900 |
Ceramic
chip
1000pF/50V
—_‘|
CC73SL1H102J
257
0006
969 | Ceramic chip
680pF/50V
CC73SL1H681J
spe
205
0233
045}
4P EH connector
base
eae
C577
257
0011 909
|
Ceramic chip 0.01F/25V
‘|
CK73B1E103K
257
0001
993
|
Ceramic chip
7pF/50V
CC73SL1H7RODJ
aha
205 0278
042}
4P EH
connector
base
(BK)
578,579 | 257
0007 900
|
Ceramic chip
100pF/50V
CC73SL1H102J
US
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580,581
|
257
0011 909
|
Ceramic
chip 0.01pF/25V
‘| CK73B1E103K
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chip
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OV COLE
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0004 961 | Ceramic ved
cee
CC73SL1H101NT
ee
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etal
(Asia/Taiwan
R.O.C.
1]
553
|
2570011 909
| Cerami
ied
0.01uF/25V
—_|
CK73B1E103K
epic
acl
pce
dsc
pike
el
endo
ade
rch
Ssh
205
0277
098] 9P
EH
connector
base
(RD)
417 0574
006]
Sub
radiator
(A)
417 0575 005
471 3304 028
513 2492 060
See Ponce ae seuatlsoey C585 —_| 254.4305 968 | Electrolytic 1.F/50V CEO4W1HO10M(SRE)
Se eran aE ae ee c586 —_| 254 4254 938 | Electrolytic 47nF/16V CEO4W1C470M
alt pores C587 | 257.0011 909 | Ceramic chip 0.01uF/25V _| CK73B1E103K
(518-519 |257 0011 909| Ceramic chip 0.01uF/25V | CK73B1E103K
Pee, sl Bokaeod soe Glocrayic 2 BEIBY CoO 257 0010 900 | Ceramic chip 0.01pF/50V _| CK73B1H103K
Sub radiator (B)
Screw 3X8 CBS-B
Fuse label for F801
205 0234 099 9P EH SID connector base
205 0892 091 | 22P FFC connector base
ic chi 205 0278 039| 3P EH connector base (BK 513 3240 033] Fuse label for F801
(522 257 0011 909| Ceramic chip 0.014F/25V | CK73B1E103K 254 4302 974 | Electrolytic 100,F/10V CEOAWIAIOIM(SRE) se (BK) 8
(523
254
4254
941
|
Electrolytic
100uF/16V
CE04W1C101M
os
;
205
0233
032|
3
P
EH
connector
base
eee 254 4260 980 | Electrolytic 10F/50V CE04W1H100M
(524~526 | 257 0011 909| Ceramic chip 0.01,F/25V CK73B1E103K en 205 0277 030} 3P EH connector base (RD) 513 2492 073] Fuse label for F802
aes 257 0010 900 | Ceramic chip 0.01F/50V | CK73B1H103K
(527 257 0002 963 | Ceramic chip 15pF/50V CC73SL1H150J 264 4302 974 | Electrolytic 100uF/0V CEOAWIAIOIM(SRE) 205 0277 043) 4P EH connector base (RD)
ee Mi 205 0278 084| 8P EH connector base (BK) 513 3240 020] Fuse label for F802
cae a — sl ag ee pve 255 4235 934 | Polypropylene film 0.01uF/100V | CQ93P2A103J(NH)
C52 memory rue 254 4254 944 | Electrolytic 100uF/16V CEO4W1C101M
530 «| 254 4250 767| Electrolytic 1000nF6.3V | CEO4WO102M
39
VIDE-V30178 / DRUCK 7