Epson PX-8 - Page 259

REV.-A
(4) When installing a part. be aware of the bending direction and length of the lead wires. Wire
should not contact other lands on the backside of the board, which could cause a short circuit.
(5)
When installing a register etc. to the board, take care that the parts do not directly contact the
surface of the board (to protect the board from the heat of the parts).
(6)
When using a wire to repair the board, keep its length to the necessary minimum.
However, if there is a lead wire across the shortest route, take another route.
•
If a longer wire must be used, fix it to the surface of the board with epoxy resin adhesive.
•
To prevent noise, do not install a long wire in parallel with the print pattern.
•
Wind the wires onto the lead wires of parts.
(7)
When soldering or removing flat package IC's , use a special soldering iron and rapidly carry
out the work. When installing an IC, place some solder on the pattern, then place the IC on the
pattern, taking care not to bend its lead pins. Quickly solder it with a soldering iron. When
placing the IC, it may be fixed with a little amount of thread tightener or adhesive.
(8)
When removing a chip component such as a square resistor, capacitor, or transistor package,
from the MAPLE board, heat all its terminal one at a time with the soldering iron.
6.3.2 Soldering
(1) Soldering the through holes
(a) Solder each lead wire as shown in the center of Fig. 6-1. (The slope of the placed solder is 30°
- 45°.)
Too much
(b) Fill the through hole with the solder.
x
• Through hole is
not filled with
solder. At least
3/4 of the hole
must be filled.
Proper
Fig. 6-1
o
~
• Proper
Fig. 6-2
6-4
Lead wire of part
-Board
Too little
x
• Pin holes
(through) are
not
allowed.