HP 10bII+ User Manual

At a Glance...14
Bonds
Bond calculations, primarily calculating bond price and yield, are performed by two keys,
]Ñ and ]Ô. These keys permit you to input data or return results. Pressing ]Û
only calculates a result. The other keys used in bond calculations only permit you to input the
data required for the calculations.
What price should you pay on April 28, 2010 for a 6.75% U.S. Treasury bond maturing on
June 4, 2020, if you want a yield of 4.75%? Assume the bond is calculated on a semiannual
coupon payment on an actual/actual basis.
If SEMI is not displayed, press
]Â to select the semiannual coupon payment.
If D.MY is displayed, press ]È to select M.DY format.
Table 1-26 Bond calculation keys
Keys Description
]Oj
Clears bond memory.
]Û
Calculates accrued interest only.
]Ô
Yield% to maturity or yield% to call date for
given price.
]Ñ
Price per 100.00 face value for a given yield.
]Î
Coupon rate stored as an annual %.
]Ë
Call value. Default is set for a call price per
100.00 face value. A bond at maturity has a
call value of 100% of its face value.
]È
Date format. Toggle between day-month-year
(dd.mmyyyy) or month-day-year (mm.ddyyyy).
]Å
Day count calendar. Toggle between Actual
(365-day calendar) or 360 (30-day month/
360-day year calendar).
]Â
Bond coupon (payment). Toggle between
semiannual and annual payment schedules.
]¾
Settlement date. Displays the current settlement
date.
]°
Maturity date or call date. The call date must
coincide with a coupon date. Displays the
current maturity.

HP 10bII+ Specifications

General

Memory registers	22
Keyboard type	Numeric
Battery type	CR2032
Auto power off	Yes
Battery technology	Lithium
Number of batteries supported	2
Type	Financial
Form factor	Pocket
Product color	Black
Digits	- digits
Display tilting	No
Display size (HxV)	63.5 x 16 mm
Display number of lines	1 lines
Display number of characters	12

Weight and Dimensions

Weight	85 g
Dimensions (WxDxH)	80.9 x 14 x 145 mm