HP Compaq 6910p Maintenance And Service Guide

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some protection,
but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, then degrade in the internal layers,
reducing its life expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal
components, observe these precautions:
Keep components in their electrostatic-safe containers until you area ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines described in
this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by different
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
Preliminary replacement requirements 37

HP Compaq 6910p Specifications

General

Bus type	FSB
Stepping	M0
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
Processor model	T8300
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo T8000 Series
Processor socket	Socket 479
Processor codename	Penryn
Processing Die size	107 mm²
Processor frequency	2.4 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor system type	Up
Processor manufacturer	Intel
Processor front side bus	800 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	12
Number of Processing Die Transistors	410 M
Motherboard chipset	Intel® PM965 Express
HDD speed	5400 RPM
HDD interface	SATA
Optical drive type	DVD±RW
Card reader integrated	Yes
Total storage capacity	160 GB
Compatible memory cards	SD
Display diagonal	14.1 \
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Memory slots	2x SO-DIMM
Internal memory	2 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Discrete graphics card model	AMD Mobility Radeon X2300
Maximum graphics card memory	0.128 GB
Audio system	HD
Type	PC
Wireless technology	802.11a/b/g/draft-n
Compatible operating systems	FreeDOS Genuine Windows Vista Enterprise Genuine Windows 2000 SuSe Linux Enterprise Desktop 10
Networking type	Fast Ethernet
Networking features	10/100/1000 NIC
Operating system installed	Windows Vista Business
Number of battery cells	6
TV-out type	S-Video
Charging port type	DC-in jack
Serial ports quantity	0
USB 2.0 ports quantity	3
Cable lock slot type	Kensington
AC adapter power	90 W
Pointing device	Touchpad + Pointing Stick
Processor code	SLAPR
Processor ARK ID	33099
Processor package size	35 x 35 mm
Country of origin	China

Weight and Dimensions

Depth	239.5 mm
Width	330 mm
Weight	2000 g
Height (front)	29.1 mm