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HP Compaq 6910p Maintenance And Service Guide

HP Compaq 6910p
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to
avoid static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools
and equipment.
Use conductive field service tools, such as cutters, screwdrivers, and vacuums.
When fixtures must directly contact dissipative surfaces, use fixtures made only of static-safe
materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and
Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn off power and input signals before inserting or removing connectors or test equipment.
38 Chapter 4 Removal and replacement procedures

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HP Compaq 6910p Specifications

General IconGeneral
Bus typeFSB
SteppingM0
Tjunction105 °C
Processor cache3 MB
Processor cores2
Processor modelT8300
System bus rate- GT/s
Processor familyIntel® Core™2 Duo
Processor seriesIntel Core 2 Duo T8000 Series
Processor socketSocket 479
Processor codenamePenryn
Processing Die size107 mm²
Processor frequency2.4 GHz
Processor cache typeL2
Processor lithography45 nm
Processor system typeUp
Processor manufacturerIntel
Processor front side bus800 MHz
Processor operating modes64-bit
ECC supported by processorNo
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)12
Number of Processing Die Transistors410 M
Motherboard chipsetIntel® PM965 Express
HDD speed5400 RPM
HDD interfaceSATA
Optical drive typeDVD±RW
Card reader integratedYes
Total storage capacity160 GB
Compatible memory cardsSD
Display diagonal14.1 \
Display resolution1280 x 800 pixels
Native aspect ratio16:10
Memory slots2x SO-DIMM
Internal memory2 GB
Memory clock speed667 MHz
Internal memory typeDDR2-SDRAM
Discrete graphics card modelAMD Mobility Radeon X2300
Maximum graphics card memory0.128 GB
Audio systemHD
TypePC
Wireless technology802.11a/b/g/draft-n
Compatible operating systemsFreeDOS Genuine Windows Vista Enterprise Genuine Windows 2000 SuSe Linux Enterprise Desktop 10
Networking typeFast Ethernet
Networking features10/100/1000 NIC
Operating system installedWindows Vista Business
Number of battery cells6
TV-out typeS-Video
Charging port typeDC-in jack
Serial ports quantity0
USB 2.0 ports quantity3
Cable lock slot typeKensington
AC adapter power90 W
Pointing deviceTouchpad + Pointing Stick
Processor codeSLAPR
Processor ARK ID33099
Processor package size35 x 35 mm
Country of originChina
Weight and Dimensions IconWeight and Dimensions
Depth239.5 mm
Width330 mm
Weight2000 g
Height (front)29.1 mm

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