2. Remove the heat sink from the system board (2).
3. Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink and system board spare part kits. The following illustration shows the replacement thermal material
locations.
Thermal paste is used on the system board processor (1) and on the heat sink area (2) that services it.
Reverse this procedure to install the heat sink.
Fingerprint reader
To remove the ngerprint reader, use this procedure and illustration.
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Chapter 5Removal and replacement procedures for authorized service provider parts
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