HP End-of-Life User Manual

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Desktop PC M01 ENERGY STAR
M01
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking
code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin
cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[x] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
PSU
1
External electrical cables and cords
DC Cable for External Power Supply
1
Gas Discharge Lamps

HP End-of-Life Specifications

General

Brand	HP
Model	End-of-Life
Category	Desktop
Language	English

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB/PCA)

Main electronic boards requiring disassembly and sorting for recycling.

Non-Li-Ion Batteries

Standard batteries (alkaline, coin) that need selective treatment.

Lithium-Ion Batteries

Lithium-ion batteries, including attached types like RTC coin cells.

Mercury-Containing Components

Components with mercury like display backlights or switches.

Large Liquid Crystal Displays (LCD)

LCD screens with backlighting, requiring specific disposal.

Cathode Ray Tubes (CRT)

Older display technology requiring specialized handling.

PCB/PCT Capacitors/Condensers

Capacitors on PCBs, potentially containing specific substances.

Large Electrolytic Capacitors

Large electrolytic capacitors requiring careful removal and disposal.

Electrical Cables and Cords

Power and data cables that may require separate handling.

Gas Discharge Lamps

Lamps that may contain hazardous gases and need special disposal.

BFR Plastics (> 25g)

Plastics over 25g with BFRs needing sorted recycling.

Toner and Ink Components

Parts with toner or ink, such as cartridges, requiring careful handling.

Asbestos-Containing Components

Materials that might contain asbestos, requiring strict safety protocols.

Ceramic Fiber Components

Items with ceramic fibers that need specialized disposal methods.

Radioactive Components

Materials with radioactive elements requiring strict regulatory compliance.

Tools Required

Product Disassembly Process

Basic Disassembly Steps Outline

Outline of basic steps for removing components requiring selective treatment.

Optional Graphic Illustration Guide

Illustrative guide for complex disassembly steps and component identification.