5. Remove the fan/heat sink assembly (4).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board components each time the fan/heat sink assembly is removed.
Replacement thermal material is included with the fan/heat sink assembly and system board
spare part kits.
Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Thermal paste
is also used on the VGA component (3) and the heat sink section (4) that services it.
NOTE: Computer models equipped with a graphics subsystem with UMA memory will not have
the components identied by callouts 3 and 4 present on the system board and fan/heat sink assembly.
Reverse this procedure to install the fan/heat sink assembly.
44 Chapter 5 Removal and replacement procedures
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