Before removing the I/O board cable, follow these steps:
1. Prepare the computer for disassembly (see Preparation for disassembly on page 50).
2. Remove the bottom cover (see Bottom cover on page 38).
3. Disconnect the battery cable from the system board (see Battery on page 50).
4. Remove the WWAN module (see WWAN module on page 41).
5. Remove the SSD (see Solid-state drive on page 43).
6. Remove the fan (see Fan on page 53).
7. Remove the system board (see System board on page 55).
Remove the I/O board cable:
1. Turn the system board upside down with the front toward you.
2. Release the ZIF connectors (1) the I/O board cable and nano SIM cable are connected to, and then
disconnect the I/O board cable (2) and nano SIM cable from the system board.
To replace the I/O board cable, reverse the removal procedures.
Heat sink
To remove the heat sink, use these procedures and illustrations.
Table 6-6
Heat sink descriptions and part numbers
Description Spare part number
For use on computer models equipped with a graphics subsystem with discrete memory N96445-001
For use on computer models equipped with a graphics subsystem with UMA memory and a 28 W
processor
N96444-601
For use on computer models equipped with a graphics subsystem with UMA memory and a 15 W
processor
N96443-001
Before removing the heat sink, follow these steps:
1. Prepare the computer for disassembly (see Preparation for disassembly on page 50).
Heat sink
59
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